Part Image

TLV274CDG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps 550uA/Ch 3MHz Rail to Rail Output

Download TLV274CDG4 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TLV274CDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 14 Ld SOIC_
click to zoom
3D Models
TLV274CDG4 - Texas Instruments  - 3D model - Small Outline Packages - 14 Ld SOIC_
click to zoom

TLV274CDG4 Details

  • Manufacturer Part Number:

    TLV274CDG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.64 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    70795

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV274CDG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with short traces, and placing the device close to the power supply and ground pins. Additionally, it's essential to separate analog and digital grounds and use a solid ground plane to reduce noise.
  • The TLV274CDG4 has a built-in POR and BOR circuitry. To handle these, ensure that the power supply ramps up slowly (typically 1-10 ms) and that the voltage stays above the BOR threshold (around 1.9 V). You can also add external circuitry to detect and respond to POR and BOR events.
  • The TLV274CDG4 can drive capacitive loads up to 100 pF. However, it's recommended to limit the load capacitance to 10-20 pF to ensure stability and optimal performance.
  • To minimize power consumption, operate the device at the lowest possible supply voltage (1.7 V), reduce the clock frequency, and use the shutdown mode when the device is not in use. Additionally, consider using a low-power mode or dynamic voltage scaling if possible.
  • The TLV274CDG4 has a thermal shutdown protection feature that activates when the junction temperature exceeds 150°C. To prevent overheating, ensure good thermal conduction between the device and the PCB, use a heat sink if necessary, and avoid operating the device at high ambient temperatures or with high power dissipation.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV274CDG4 Overview

Use the download button to access the TLV274CDG4 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV27, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV274CDG4

Showing 0 results

TLV274CDG4 Alternates

Showing results

Image Part Number Model
Part Image TLV274CDR Texas Instruments

Operational Amplifier, 4 Func, 5000uV Offset-Max, CMOS, PDSO14

Part Image TLV274CD Texas Instruments

Operational Amplifier, 4 Func, 5000uV Offset-Max, CMOS, PDSO14

Part Image TLV274CDRG4 Texas Instruments

Operational Amplifier, 4 Func, 7000uV Offset-Max, CMOS, PDSO14