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TLV274ID - Texas Instruments

Description: Texas Instruments TLV274ID, Quad Op Amp, 3MHz CMOS, Rail to Rail, 5 V, 14-Pin SOIC

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TLV274ID - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-14N
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TLV274ID - Texas Instruments  - 3D model - Other - SOIC127P600X175-14N
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TLV274ID Details

  • Manufacturer Part Number:

    TLV274ID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia, Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.64 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    70795

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV274ID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV274ID is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100pF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • To minimize noise and EMI, it's recommended to keep the input and output traces short and away from each other, use a ground plane, and decouple the power supply with a 0.1uF capacitor. Additionally, avoid routing high-frequency signals near the op-amp's inputs.
  • The TLV274ID is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate the op-amp in a high-temperature environment, consider using a heat sink or a thermally-enhanced package.
  • The TLV274ID has internal ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device, such as using an ESD wrist strap or mat, and storing the device in an anti-static bag.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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