Mainland China, Malaysia, Mexico, Philippines, Taiwan
ECCN Code:
EAR99
HTS Code:
8542.33.00.01
Manufacturer:
Texas Instruments
YTEOL:
0
Amplifier Type:
OPERATIONAL AMPLIFIER
Architecture:
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB):
0.00006 µA
Bias Current-Max (IIB) @25C:
0.00006 µA
Common-mode Reject Ratio-Min:
65 dB
Common-mode Reject Ratio-Nom:
80 dB
Frequency Compensation:
YES
Input Offset Current-Max (IIO):
0.00006 µA
Input Offset Voltage-Max:
5000 µV
JESD-30 Code:
R-PDSO-G14
JESD-609 Code:
e4
Length:
8.65 mm
Low-Bias:
YES
Low-Offset:
NO
Micropower:
NO
Moisture Sensitivity Level:
1
Neg Supply Voltage Limit-Max:
-8.25 V
Neg Supply Voltage-Nom (Vsup):
-5 V
Number of Functions:
4
Number of Terminals:
14
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP14,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Packing Method:
TUBE
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
1.75 mm
Slew Rate-Min:
1 V/us
Slew Rate-Nom:
2.1 V/us
Subcategory:
Operational Amplifier
Supply Current-Max:
2.64 mA
Supply Voltage Limit-Max:
8.25 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
3000
Voltage Gain-Min:
70795
Wideband:
NO
Width:
3.9 mm
TLV274IDG4 Frequently Asked Questions (FAQs)
The maximum power dissipation of the TLV274IDG4 is dependent on the ambient temperature and the package type. For the SOIC package, the maximum power dissipation is 670mW at 25°C ambient temperature. However, it's recommended to derate the power dissipation to ensure reliable operation.
To minimize noise and ensure stability, it's recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping the input and output traces short and away from each other. Additionally, decoupling capacitors should be placed close to the op-amp power pins.
The recommended decoupling capacitor value is typically in the range of 0.01uF to 0.1uF, with a voltage rating that matches or exceeds the op-amp's supply voltage. A 0.1uF ceramic capacitor is a good starting point, but the optimal value may vary depending on the specific application and PCB layout.
While the TLV274IDG4 is an op-amp, it can be used as a comparator in certain applications. However, it's not recommended for high-speed or high-frequency comparator applications due to its limited slew rate and bandwidth. Additionally, the op-amp's output stage is not designed for high-current drive, so it may not be suitable for driving heavy loads.
The TLV274IDG4 has built-in ESD protection, but it's still recommended to follow good ESD handling practices during manufacturing and assembly. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD-protective packaging and storage.
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TLV274IDG4 Overview
Use the download button to access the TLV274IDG4 schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
