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TLV2760IDBVR - Texas Instruments

Description: Operational Amplifiers - Op Amps Sngl 1.8-V Micropwr R-to-R Single Sply

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TLV2760IDBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - ADC081S021CIMF/NOPB-1
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3D Models
TLV2760IDBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - ADC081S021CIMF/NOPB-1
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TLV2760IDBVR Details

  • Manufacturer Part Number:

    TLV2760IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.07 V/us

  • Slew Rate-Nom:

    0.22 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.028 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    500

  • Voltage Gain-Min:

    18000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2760IDBVR Frequently Asked Questions (FAQs)

  • It is recommended to place the TLV2760IDBVR close to the analog signal sources, use a solid ground plane, and keep the input traces short and away from digital signals. Additionally, use a 0.1uF decoupling capacitor between VCC and GND, and a 10uF capacitor between VCC and AVCC.
  • Verify that the supply voltage is within the recommended range of 2.7V to 5.5V, and the operating temperature is within the range of -40°C to 125°C. Also, ensure that the input signals are within the recommended common-mode voltage range.
  • Use a low-impedance source, such as an op-amp output, to drive the inputs of the TLV2760IDBVR. Avoid using high-impedance sources, such as a resistive divider, as they can cause signal attenuation and distortion.
  • Use the shutdown pin (SHDN) to disable the device when not in use. Additionally, consider using a lower supply voltage, such as 3.3V, to reduce power consumption. However, be aware that this may affect the device's performance.
  • Use a low-pass filter, such as an RC filter, to filter the output of the TLV2760IDBVR. The filter should be designed to remove high-frequency noise and aliasing, while preserving the desired signal bandwidth.

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TLV2760IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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