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TLV2772IDGKR - Texas Instruments

Description: Dual 2.7-V High Slew Rate Rail-To-Rail Output Operational Amplifier

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TLV2772IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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TLV2772IDGKR Details

  • Manufacturer Part Number:

    TLV2772IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00035 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    96 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    4.7 V/us

  • Slew Rate-Nom:

    10.5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    4 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5100

  • Voltage Gain-Min:

    13000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2772IDGKR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV2772IDGKR involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the bypass capacitor (C1) and to keep the input and output capacitors (C2 and C3) as close to the device as possible.
  • The values of C2 and C3 depend on the specific application and the desired frequency response. A good starting point is to use the values recommended in the datasheet (10uF for C2 and 10uF for C3). However, you may need to adjust these values based on your specific requirements. For example, if you need a higher bandwidth, you may need to use smaller capacitor values.
  • The TLV2772IDGKR has an absolute maximum input voltage rating of 16V. Exceeding this voltage can damage the device. It's recommended to ensure that the input voltage is within the recommended operating range of 2.7V to 12V to ensure reliable operation.
  • To prevent overheating, ensure that the device is operated within its recommended operating conditions, including the power supply voltage, input voltage, and output current. Additionally, ensure that the device is properly mounted on a PCB with a solid ground plane and that the thermal pad is properly connected to a heat sink or a thermal relief pattern.
  • A recommended thermal relief pattern for the TLV2772IDGKR involves creating a solid copper pour on the PCB with a thermal relief pattern consisting of a series of small holes or thermal vias that connect the thermal pad to the ground plane. This helps to dissipate heat effectively and prevent overheating.

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TLV2772IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV2772IDGK Texas Instruments

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