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TLV2774IDR - Texas Instruments

Description: Operational Amplifiers - Op Amps Quad 2.7-V High-Slew Rate R-To-R Output

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TLV2774IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLV2774IDR - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLV2774IDR Details

  • Manufacturer Part Number:

    TLV2774IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00035 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    96 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    4.7 V/us

  • Slew Rate-Nom:

    10.5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    8 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5100

  • Voltage Gain-Min:

    13000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2774IDR Frequently Asked Questions (FAQs)

  • The TLV2774IDR is a high-frequency device, so it's essential to follow good layout practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using short traces, and avoiding vias under the device. Additionally, it's recommended to use a solid ground plane and to decouple the power supply with a 10uF capacitor.
  • The TLV2774IDR has a rail-to-rail output stage, which means the output voltage swing is close to the supply voltage. To handle this, ensure that the load impedance is high enough to prevent excessive current draw, and consider adding a voltage divider or a buffer stage if the output voltage needs to be attenuated or isolated.
  • The TLV2774IDR's performance is affected by temperature, with the gain bandwidth product and slew rate decreasing at higher temperatures. However, the device is designed to operate over a wide temperature range (-40°C to 125°C), and TI provides temperature-dependent graphs in the datasheet to help designers estimate the device's performance under different temperature conditions.
  • To ensure stability, it's essential to follow the recommended compensation techniques outlined in the datasheet. This includes selecting the correct compensation capacitor values, ensuring the feedback loop has sufficient phase margin, and avoiding high-frequency poles in the feedback network.
  • The TLV2774IDR has a specific power-up sequence to ensure proper operation. TI recommends powering up the device with the input voltage (VIN) first, followed by the output voltage (VOUT). This sequence helps prevent latch-up and ensures the device starts up in a stable state.

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TLV2774IDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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