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TLV2782AID - Texas Instruments

Description: Dual 1.8V RRIO, 8MHz Amplifier

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TLV2782AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 8-SOIC*-*
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TLV2782AID Details

  • Manufacturer Part Number:

    TLV2782AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.89 V/us

  • Slew Rate-Nom:

    5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.64 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2782AID Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground connection for the GND pins, and placing the device close to the power supply bypass capacitors to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • The thermal shutdown feature is designed to protect the device from overheating. If the device exceeds the thermal shutdown temperature (typically 150°C), it will shut down. To handle this, ensure good thermal design, use a heat sink if necessary, and monitor the device temperature using the thermal shutdown indicator pin (if available).
  • While the datasheet specifies a minimum input voltage of 2.7V, it's recommended to operate the device with a minimum input voltage of 3V to ensure stable operation and to account for voltage drops in the system.
  • Use a low-pass filter (e.g., RC filter) on the output of the device to filter out high-frequency noise and ripple. The filter values will depend on the specific application and noise requirements.
  • While the device is rated for operation up to 125°C, it's essential to consider the device's thermal design and the system's thermal management when operating in high-temperature environments. Ensure the device is properly heat-sinked and the system is designed to handle the increased temperatures.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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