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TLV2782IDR - Texas Instruments

Description: Op Amp Dual High Speed Amplifier R-R I/O ±1.8V/3.6V 8-Pin SOIC T/R

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TLV2782IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A  SOIC
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TLV2782IDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A  SOIC
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TLV2782IDR Details

  • Manufacturer Part Number:

    TLV2782IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia, Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.89 V/us

  • Slew Rate-Nom:

    5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.54 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2782IDR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the TLV2782IDR placed close to the power supply pins, and the input and output capacitors placed as close as possible to the device. A star-ground configuration is also recommended to minimize noise and EMI.
  • The TLV2782IDR has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour can be used to connect the thermal pad to the thermal plane. Additionally, the device should be placed in a well-ventilated area to ensure good airflow.
  • Texas Instruments recommends using a 1-10uF input capacitor and a 1-22uF output capacitor, depending on the specific application and output current requirements. The capacitors should be placed as close as possible to the device and should have a low ESR to minimize noise and ripple.
  • To ensure stability, the TLV2782IDR requires a minimum output capacitance of 1uF, and the output capacitor should be placed close to the device. Additionally, the input and output capacitors should be selected to have a low ESR, and the PCB layout should be designed to minimize noise and EMI. A stability analysis can be performed using the Texas Instruments WEBENCH tool or other simulation software.
  • The TLV2782IDR can deliver up to 150mA of output current, depending on the input voltage and output voltage requirements. However, the device should be operated within its recommended operating conditions to ensure reliability and prevent overheating.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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