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TLV27L1IDBVRG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps 11-uA/Ch 160kHz RR-Out Op Amp

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PCB Footprints
TLV27L1IDBVRG4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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TLV27L1IDBVRG4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV27L1IDBVRG4 Details

  • Manufacturer Part Number:

    TLV27L1IDBVRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.06 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.011 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    160

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV27L1IDBVRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general best practices for op-amp layout, such as keeping the input and output traces short and away from noise sources, and using a solid ground plane.
  • The gain resistors (R1 and R2) should be chosen based on the desired gain and bandwidth of the amplifier. A higher gain requires smaller resistors, but may also increase noise and reduce bandwidth. Texas Instruments provides a gain resistor calculator tool to help with this selection.
  • The maximum power dissipation of TLV27L1IDBVRG4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 660mW at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating conditions.
  • Yes, TLV27L1IDBVRG4 can be used as a unity-gain buffer by connecting the output directly to the inverting input (i.e., R1 = R2). However, it's important to ensure that the input impedance is high enough to avoid loading the source, and that the output is not overloaded.
  • TLV27L1IDBVRG4 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.

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TLV27L1IDBVRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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