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TLV27L1IDBVT - Texas Instruments

Description: Texas Instruments TLV27L1IDBVT Op Amp, 0.16MHz Rail-Rail, 3 → 15 V, 5-Pin SOT-23

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PCB Footprints
TLV27L1IDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Pin SOT-23_
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3D Models
TLV27L1IDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - 5-Pin SOT-23_
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TLV27L1IDBVT Details

  • Manufacturer Part Number:

    TLV27L1IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.06 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.011 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    160

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV27L1IDBVT Frequently Asked Questions (FAQs)

  • A good PCB layout for TLV27L1IDBVT involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for power decoupling.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a low-ESR capacitor, and ensure that the output capacitor is properly sized. Additionally, the input and output resistors should be chosen to ensure that the device operates within its stable region.
  • The maximum power dissipation of TLV27L1IDBVT is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature.
  • Yes, TLV27L1IDBVT is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended operating conditions and derate the device's power dissipation accordingly.
  • To troubleshoot issues with TLV27L1IDBVT, start by verifying the power supply voltage, checking for proper PCB layout and decoupling, and ensuring that the input and output resistors are correctly sized. If issues persist, consult the datasheet and application notes for guidance.

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TLV27L1IDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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