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TLV27L2IDGKR - Texas Instruments

Description: 11-uA/Channel, 160kHz, RR-Out Dual Op Amp

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TLV27L2IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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TLV27L2IDGKR Details

  • Manufacturer Part Number:

    TLV27L2IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.06 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.022 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    160

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

TLV27L2IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The thermal shutdown feature is designed to protect the device from overheating. When the junction temperature exceeds 150°C, the device will shut down. To handle this, ensure proper thermal design, use a heat sink if necessary, and monitor the device's temperature using the thermal shutdown indicator pin (TSD).
  • The recommended input capacitor value is 1 μF to 10 μF, depending on the input voltage and output current requirements. A larger capacitor value can help reduce input voltage ripple and improve output stability.
  • Yes, TLV27L2IDGKR is rated for operation up to 125°C. However, ensure that the device is properly derated for temperature, and consider using a heat sink or other thermal management techniques to maintain a safe operating temperature.
  • Common causes of oscillations or instability include improper PCB layout, inadequate input and output capacitors, and incorrect component values. Check the datasheet and application notes for recommended component values and PCB layout guidelines. Use a oscilloscope to measure the output voltage and current, and adjust the component values or layout as needed to achieve stability.

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TLV27L2IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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