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TLV365QDBVRQ1 - Texas Instruments

Description: Operational Amplifiers - Op Amps Automotive 50-MHz si ngle-supply operatio

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PCB Footprints
TLV365QDBVRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
TLV365QDBVRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV365QDBVRQ1 Details

  • Manufacturer Part Number:

    TLV365QDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00002 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    115 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1900 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    27 V/us

  • Supply Current-Max:

    6.3 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    50000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV365QDBVRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the input and output traces short, using a solid ground plane, and minimizing noise coupling. Additionally, consider using a 4-layer PCB with a dedicated power plane and a separate ground plane.
  • To ensure stability, follow the recommended compensation network values and layout guidelines. Additionally, ensure that the output capacitor is properly sized and placed close to the output pin. If oscillations occur, try adding a small series resistor (e.g., 1-10 ohms) between the output and the capacitor.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V or less to ensure reliable operation and prevent damage to the device.
  • The TLV365QDBVRQ1 is rated for operation up to 125°C, but it's essential to consider the device's power dissipation and thermal management. Ensure that the device is properly heatsinked, and the PCB is designed to handle high temperatures. Consult the datasheet and Texas Instruments' application notes for more information.
  • The output capacitor value and type depend on the specific application requirements. As a general guideline, use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 1-10uF. Consult the datasheet and application notes for more information on capacitor selection and layout considerations.

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TLV365QDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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