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TLV3702IDR - Texas Instruments

Description: Dual Nanopower High-Voltage Comparator

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TLV3702IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV3702IDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV3702IDR Details

  • Manufacturer Part Number:

    TLV3702IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    240000 ns

  • Seated Height-Max:

    1.75 mm

  • Subcategory:

    Comparator

  • Supply Current-Max:

    0.0016 mA

  • Supply Voltage Limit-Max:

    17 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV3702IDR Frequently Asked Questions (FAQs)

  • The TLV3702IDR is a high-frequency device, so it's essential to follow good PCB layout practices to minimize noise and ensure proper operation. Place the device close to the power supply, use short traces, and avoid vias under the device. Also, ensure that the input and output traces are well-separated to minimize crosstalk.
  • The TLV3702IDR has a specific power-up sequence requirement. Ensure that the VCC pin is powered up before the VIN pin. Also, the EN pin should be pulled high after VCC is stable. Failure to follow this sequence may result in improper operation or damage to the device.
  • The TLV3702IDR can drive capacitive loads up to 100 pF. However, it's essential to consider the output impedance and the frequency of operation when selecting the capacitive load. Exceeding the recommended capacitive load may result in oscillations or instability.
  • To filter out noise and ripple on the output of the TLV3702IDR, use a low-pass filter with a cutoff frequency below the switching frequency. A simple RC filter or a more complex filter like a pi-filter can be used. Ensure that the filter components are selected to minimize the impact on the output voltage and current.
  • The TLV3702IDR has a thermal derating of 6.4 mW/°C above 25°C. This means that the device's power dissipation should be reduced as the ambient temperature increases to prevent overheating and ensure reliable operation.

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TLV3702IDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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