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TLV5614CD - Texas Instruments

Description: 12-Bit, 3 us Quad DAC, Serial Input, Pgrmable Settling Time, Low Power, H/W or S/W PowerDown

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TLV5614CD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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TLV5614CD - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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TLV5614CD Details

  • Manufacturer Part Number:

    TLV5614CD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.9 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.102 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    20 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    5.6 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV5614CD Frequently Asked Questions (FAQs)

  • The TLV5614CD is a high-frequency device, so it's essential to follow good layout and placement practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using short traces, and avoiding vias under the device. Additionally, decoupling capacitors should be placed as close to the device as possible.
  • The TLV5614CD has a high output voltage swing, which can cause issues if not properly handled. To avoid this, ensure that the output is properly terminated, and consider using a voltage divider or a buffer amplifier to reduce the output voltage swing if necessary.
  • To ensure proper operation, TI recommends powering up the TLV5614CD in the following sequence: VCC, AVCC, and then the analog input signal. This sequence helps prevent latch-up and ensures that the device starts up correctly.
  • To minimize noise and interference, use a solid ground plane, keep analog and digital signals separate, and use shielding if necessary. Additionally, consider using a ferrite bead or a common-mode choke to filter out high-frequency noise.
  • The TLV5614CD is rated for operation from -40°C to 125°C. However, it's essential to consider the device's thermal characteristics and ensure proper heat dissipation to prevent overheating and ensure reliable operation.

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TLV5614CD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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