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TLV5616CDGK - Texas Instruments

Description: 12-bit, single-channel, low-power, voltage output DAC with programmable settling time vs power

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TLV5616CDGK - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV5616CDGK - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV5616CDGK Details

  • Manufacturer Part Number:

    TLV5616CDGK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    3.2 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.102 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    20 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    1.35 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLV5616CDGK Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the device placed close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) it is driving. The device should be placed on a solid ground plane, and the analog and digital grounds should be separated to minimize noise coupling.
  • The POR and BOR features of the TLV5616CDGK can be handled by connecting the POR pin to a capacitor and a pull-up resistor to VCC. The BOR threshold can be adjusted by connecting a resistor divider network to the BOR pin. It is recommended to consult the datasheet and application notes for specific guidance on implementing these features.
  • The maximum clock frequency that can be used with the TLV5616CDGK is 50 MHz. However, the actual clock frequency used should be determined by the specific application requirements and the device's operating conditions.
  • The TLV5616CDGK is specified to operate over a temperature range of -40°C to 125°C. To ensure the device operates within this range, the system designer should consider the thermal characteristics of the device, the PCB layout, and the operating conditions of the system. Thermal management techniques such as heat sinking and thermal interface materials may be necessary to maintain the device within its specified temperature range.
  • The TLV5616CDGK is a digital-to-analog converter and can generate electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize EMI and RFI, the system designer should consider using shielding, filtering, and grounding techniques. The device should be placed in a shielded enclosure, and the PCB layout should be designed to minimize radiation and coupling.

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TLV5616CDGK Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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