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TLV5616IDGKR - Texas Instruments

Description: Digital to Analog Converters - DAC 2.7-5.5 V Low Power 12-Bit

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TLV5616IDGKR - Texas Instruments - PCB symbol
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TLV5616IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK(S-PDOS-G8)
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TLV5616IDGKR - Texas Instruments - 3D model - Small Outline Packages - DGK(S-PDOS-G8)
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TLV5616IDGKR Details

  • Manufacturer Part Number:

    TLV5616IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    3.2 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.102 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    20 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    1.35 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLV5616IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following a star-grounding topology, keeping analog and digital grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from digital signals.
  • The TLV5616IDGKR has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or heat sinks in high-temperature applications.
  • Power up the VCC pin first, followed by the VREF pin, and then the digital control pins. Ensure that the VCC pin is stable before applying any digital signals.
  • Use an oscilloscope to monitor the output voltage and input signals. Check for proper power-up sequencing, ensure that the input signals are within the specified range, and verify that the output load is within the recommended range. Consult the datasheet and application notes for troubleshooting guides.
  • The TLV5616IDGKR is not specifically designed for radiation-hardened or high-reliability applications. However, Texas Instruments offers other products that are designed for such applications. Consult with a TI representative or refer to the TI website for more information.

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TLV5616IDGKR Overview

Use the download button to access the TLV5616IDGKR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV56, or try a keyword search, such as Digital to Analog Converters

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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