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TLV5618AMDREP - Texas Instruments

Description: Enhanced Product Digital-To-Analog Converter With Power Down

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TLV5618AMDREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV5618AMDREP - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV5618AMDREP Details

  • Manufacturer Part Number:

    TLV5618AMDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.1 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.093 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV5618AMDREP Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLV5618AMDREP involves placing the device close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) it is driving, and using a ground plane to minimize noise and radiation. Additionally, it is recommended to use a 0.1uF decoupling capacitor between the VCC and GND pins, and to keep the analog and digital grounds separate.
  • To ensure the TLV5618AMDREP operates within its specified temperature range, it is recommended to provide adequate heat sinking, such as a thermal pad or heat sink, and to ensure good airflow around the device. Additionally, the device should be operated within its specified temperature range of -40°C to 125°C.
  • The recommended power-up sequence for the TLV5618AMDREP is to first apply the analog power supply (VCC) and then the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, which helps to prevent any potential latch-up or damage to the device.
  • During power-down or reset, the TLV5618AMDREP's output current should be limited to prevent damage to the device or other components in the system. This can be achieved by using a current-limiting resistor or a switch to disconnect the output from the load.
  • The recommended method for filtering the TLV5618AMDREP's output is to use a low-pass filter, such as an RC filter or an active filter, to remove any high-frequency noise or ripple. The filter should be designed to have a cutoff frequency that is significantly higher than the output signal frequency.

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TLV5618AMDREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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