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TLV5624CDGK - Texas Instruments

Description: 8-Bit, 1.0 to 3.5 us DAC, Serial Input, Pgrmable Int. Ref., Settling Time

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TLV5624CDGK - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV5624CDGK - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV5624CDGK Details

  • Manufacturer Part Number:

    TLV5624CDGK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.9 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.233 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    3.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLV5624CDGK Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended layout and routing guide in their application note SLVAE03, which includes guidelines for PCB layout, component placement, and routing to minimize noise and ensure optimal performance.
  • The output capacitor value depends on the desired output voltage ripple, output current, and stability requirements. A general guideline is to use a capacitor with a value between 10uF to 22uF, with a low ESR (Equivalent Series Resistance) and a voltage rating that exceeds the output voltage. TI's WEBENCH tool can also be used to simulate and optimize the output capacitor value.
  • Although the datasheet specifies a maximum input voltage of 5.5V, the device can handle input voltages up to 6V for short durations (e.g., during power-up or voltage transients). However, continuous operation above 5.5V is not recommended and may affect the device's reliability and performance.
  • The TLV5624CDGK is rated for operation up to 125°C, but its performance and reliability may degrade at high temperatures. It's essential to consider the device's thermal characteristics, such as junction temperature and thermal resistance, when designing for high-temperature applications. TI's thermal calculation tool can help estimate the device's junction temperature.
  • To ensure output voltage accuracy and stability, it's crucial to follow proper PCB layout and routing guidelines, use a stable input voltage, and select the correct output capacitor value. Additionally, the device's output voltage can be trimmed using the VREF pin, and the output voltage accuracy can be improved by using an external voltage reference.

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TLV5624CDGK Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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