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TLV5625CD - Texas Instruments

Description: Texas Instruments TLV5625CD, 2-channel 8 bit Serial DAC, 93ksps, 8-Pin SOIC

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TLV5625CD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV5625CD - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV5625CD Details

  • Manufacturer Part Number:

    TLV5625CD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.6 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.093 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV5625CD Frequently Asked Questions (FAQs)

  • The TLV5625CD is a high-frequency device, so it's essential to follow good PCB layout practices to minimize noise and ensure signal integrity. Place the device close to the power supply, use short traces, and avoid vias under the device. Also, ensure that the analog and digital grounds are separated and connected at a single point.
  • The internal oscillator's frequency can vary with temperature. To minimize this effect, use a crystal oscillator or an external clock source. If you must use the internal oscillator, consider using a temperature-compensated oscillator or a clock source with a stable frequency reference.
  • The TLV5625CD can drive a maximum capacitive load of 100 pF. Exceeding this limit may cause instability or oscillations. If you need to drive a higher capacitive load, consider adding a buffer or using a device with a higher drive capability.
  • To ensure the POR circuitry works correctly, ensure that the power supply ramps up slowly (typically 1-2 ms) and that the voltage reaches the minimum operating voltage (VDD) before the device starts operating. Also, avoid applying signals to the device before the power supply has stabilized.
  • To power down the TLV5625CD, slowly ramp down the power supply voltage (VDD) to 0 V. Avoid applying signals to the device during power-down, and ensure that all inputs are in a stable state before powering down.

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TLV5625CD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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