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TLV5626ID - Texas Instruments

Description: 2.7-V TO 5.5-V LOW-POWER DUAL 8-BIT DIGITAL-TO-ANALOG CONVERTER WITH INTERNAL REFERENCE AND POWER DOWN

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TLV5626ID - Texas Instruments - PCB symbol
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TLV5626ID - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-8N
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TLV5626ID - Texas Instruments - 3D model - Other - SOIC127P600X175-8N
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TLV5626ID Details

  • Manufacturer Part Number:

    TLV5626ID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.6 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.3906%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.278 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    5.5 µs

  • Settling Time-Nom (tstl):

    0.8 µs

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV5626ID Frequently Asked Questions (FAQs)

  • The TLV5626ID is a high-frequency device, so it's essential to follow good layout and placement practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using a solid ground plane, and keeping the input and output traces short and separate.
  • The TLV5626ID can dissipate up to 1.4W of power, so it's crucial to ensure proper thermal management. TI recommends using a thermal pad or heat sink, and keeping the device away from other heat sources. The device's thermal resistance (θJA) is 30°C/W, so ensure the PCB design takes this into account.
  • The TLV5626ID requires input and output capacitance to ensure stability and proper operation. TI recommends using 10nF to 100nF ceramic capacitors for input and output decoupling, and placing them as close to the device as possible.
  • The TLV5626ID can be configured for different output voltage ranges by adjusting the resistor divider network (R1 and R2) and the feedback resistor (R3). TI provides a calculation tool or equations to determine the required resistor values for a specific output voltage range.
  • The TLV5626ID is a high-frequency device, so it's essential to use a PCB material with low dielectric loss and high thermal conductivity. TI recommends using a high-quality FR4 or Rogers material with a thickness of 0.8mm to 1.6mm.

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TLV5626ID Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV5626CD Texas Instruments

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