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TLV5627CD - Texas Instruments

Description: 8-Bit, 3 us Quad DAC, Serial Input, Low Power, H/W or S/W Power Down

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TLV5627CD - Texas Instruments - PCB symbol
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PCB Footprints
TLV5627CD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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TLV5627CD - Texas Instruments - 3D model - Small Outline Packages - D (R-PDSO-G16)
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TLV5627CD Details

  • Manufacturer Part Number:

    TLV5627CD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.1 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.107 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    18 µs

  • Settling Time-Nom (tstl):

    2.5 µs

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.905 mm

TLV5627CD Frequently Asked Questions (FAQs)

  • The TLV5627CD is a high-frequency device, so it's essential to follow good layout and placement practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using a solid ground plane, and keeping the input and output traces short and separate.
  • The TLV5627CD can dissipate up to 1.4W of power, so it's crucial to ensure proper thermal management. TI recommends using a thermal pad or heat sink, and ensuring good airflow around the device. The device's thermal resistance (θJA) is 30°C/W, so it's essential to keep the junction temperature below 150°C.
  • The TLV5627CD requires input and output capacitance to ensure stability and proper operation. TI recommends using 10uF to 22uF ceramic capacitors for the input and output, with a voltage rating of at least 10V. The capacitors should be placed as close to the device as possible.
  • The TLV5627CD can be configured for different output voltage ranges by adjusting the resistive divider network. TI provides a formula to calculate the required resistor values for a specific output voltage range. The formula is: R1 = (VOUT - 1.25) / (1.25 / R2), where R1 and R2 are the resistors in the divider network.
  • The TLV5627CD requires a specific start-up sequence to ensure proper operation. TI recommends applying the input voltage (VIN) before enabling the device (EN pin). The EN pin should be pulled high after VIN has reached its nominal value. This sequence ensures that the device starts up correctly and avoids any potential latch-up conditions.

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TLV5627CD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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