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TLV5631IDW - Texas Instruments

Description: Texas Instruments TLV5631IDW, 8-channel 10 bit Serial DAC, 283ksps, 20-Pin SOIC

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TLV5631IDW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0020A
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TLV5631IDW - Texas Instruments  - 3D model - Small Outline Packages - DW0020A
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TLV5631IDW Details

  • Manufacturer Part Number:

    TLV5631IDW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.1 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.283 MHz

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    21 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TLV5631IDW Frequently Asked Questions (FAQs)

  • It is recommended to place the TLV5631IDW close to the analog-to-digital converter (ADC) and to use a ground plane to minimize noise. Additionally, it is recommended to use a 4-layer PCB with a dedicated analog ground plane to reduce noise and electromagnetic interference (EMI).
  • The TLV5631IDW has an internal calibration circuit that is enabled by applying a specific voltage to the CAL pin. The calibration procedure involves applying a voltage to the CAL pin, waiting for the calibration cycle to complete, and then verifying the output voltage. Refer to the datasheet for specific calibration procedures and timing diagrams.
  • The TLV5631IDW has a maximum junction temperature of 150°C. To ensure reliable operation over temperature, it is recommended to provide adequate heat sinking, use a thermally conductive PCB material, and avoid operating the device near its maximum junction temperature. Additionally, it is recommended to follow the thermal design guidelines outlined in the datasheet.
  • The TLV5631IDW has a typical output voltage noise of 10mVpp. To minimize output voltage noise and ripple, it is recommended to use a low-pass filter, such as a RC filter, and to decouple the output with a capacitor. Additionally, it is recommended to use a high-quality output capacitor with low equivalent series resistance (ESR) to minimize output voltage ripple.
  • The TLV5631IDW is designed to meet the electromagnetic compatibility (EMC) requirements of various regulatory bodies. To ensure compliance with regulatory requirements, it is recommended to follow the PCB layout guidelines outlined in the datasheet, use a shielded enclosure, and ensure that the device is properly grounded. Additionally, it is recommended to perform EMC testing to ensure compliance with regulatory requirements.

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TLV5631IDW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV5631IDWR Texas Instruments

D/A Converter, 1 Func, Serial Input Loading, 1us Settling Time, PDSO20