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TLV5636IDGK - Texas Instruments

Description: 0.05µV/°C max, SINGLE-SUPPLY CMOS OPERATIONAL AMPLIFIERS Zer.-Drift Series

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TLV5636IDGK - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK0008A
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TLV5636IDGK - Texas Instruments  - 3D model - Small Outline Packages - DGK0008A
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TLV5636IDGK Details

  • Manufacturer Part Number:

    TLV5636IDGK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.9 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.233 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    3.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLV5636IDGK Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLV5636IDGK involves keeping the analog and digital grounds separate, using a star-grounding configuration, and placing the device close to the analog signal sources to minimize noise.
  • The power-up and power-down sequencing for the TLV5636IDGK involves powering up the analog supply (AVDD) before the digital supply (DVDD), and powering down the digital supply before the analog supply to prevent latch-up.
  • The TLV5636IDGK can handle clock frequencies up to 20 MHz, but the maximum frequency may vary depending on the specific application and system requirements.
  • The TLV5636IDGK requires a one-time calibration process to optimize its performance. This involves applying a known input voltage and adjusting the internal offset and gain to achieve the desired accuracy.
  • The TLV5636IDGK's performance is affected by temperature, with changes in offset voltage, gain, and linearity over the operating temperature range. The device is specified to operate from -40°C to 125°C.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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