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TLV9001QDBVRQ1 - Texas Instruments

Description: Operational Amplifiers - Op Amps Automotive, single-channel, 5.5-V 1-MHz rail-to-rail input and output operational amplifier

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TLV9001QDBVRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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TLV9001QDBVRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV9001QDBVRQ1 Details

  • Manufacturer Part Number:

    TLV9001QDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1600 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    0.085 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    158489.3

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV9001QDBVRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLV9001QDBVRQ1 datasheet, which includes guidelines for component placement, routing, and thermal management. Additionally, TI offers a PCB layout checklist and a layout guide for op-amps, which can be found on their website.
  • To ensure stability and prevent oscillations, it's essential to follow proper PCB layout and routing guidelines, use adequate decoupling capacitors, and choose the correct gain and feedback resistors. Additionally, TI recommends using a compensation capacitor (Cc) between the output and the inverting input pins to improve stability.
  • The maximum power dissipation of TLV9001QDBVRQ1 is dependent on the ambient temperature and the package type. The datasheet provides a power dissipation calculation formula, which takes into account the output current, supply voltage, and thermal resistance. Engineers can use this formula to calculate the maximum power dissipation and ensure the device operates within safe limits.
  • TLV9001QDBVRQ1 is rated for operation up to 125°C, but the device's performance and reliability may degrade at higher temperatures. Engineers should consult the datasheet for temperature-related specifications, such as the maximum junction temperature, and ensure the device is properly derated for high-temperature applications.
  • The selection of input and output capacitors depends on the specific application requirements, such as frequency response, noise tolerance, and output current. TI recommends using low-ESR capacitors with a minimum capacitance of 10nF for input and output decoupling. Engineers should consult the datasheet and application notes for more detailed guidance on capacitor selection.

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TLV9001QDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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