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TLV9002QDGKRQ1 - Texas Instruments

Description: AEC-Q100 2-channel, 1-MHz, RRIO, 1.8-V to 5.5-V operational amplifier

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TLV9002QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV9002QDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV9002QDGKRQ1 Details

  • Manufacturer Part Number:

    TLV9002QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-06-11

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    0.17 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    158489.3

  • Wideband:

    NO

  • Width:

    3 mm

TLV9002QDGKRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for TLV9002QDGKRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended PCB layout, use a low-ESR capacitor for decoupling, and add a 10nF-100nF capacitor in parallel with the output resistor. Also, ensure that the output is not overloaded and the input voltage is within the recommended range.
  • The maximum power dissipation of TLV9002QDGKRQ1 is 1.4W. To calculate the power dissipation, use the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • Yes, TLV9002QDGKRQ1 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure that the device is properly heatsinked and follow the recommended thermal design guidelines.
  • Use a voltage supervisor or a voltage monitor to detect overvoltage and undervoltage conditions. Add a voltage clamp or a TVS diode to protect the device from voltage transients. Also, ensure that the input voltage is within the recommended range of 2.7V to 5.5V.

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TLV9002QDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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