Part Image

TLV9002SIDGSR - Texas Instruments

Description: 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems

Download TLV9002SIDGSR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TLV9002SIDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
click to zoom
3D Models
TLV9002SIDGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
click to zoom

TLV9002SIDGSR Details

  • Manufacturer Part Number:

    TLV9002SIDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    158489

  • Wideband:

    NO

  • Width:

    3 mm

TLV9002SIDGSR Frequently Asked Questions (FAQs)

  • The TLV9002SIDGSR is a sensitive analog device, and proper layout and placement are crucial for optimal performance. It is recommended to place the device close to the power supply, use a solid ground plane, and keep the input and output traces short and separate to minimize noise and interference.
  • To ensure stability and prevent oscillations, it is essential to follow the recommended compensation capacitor values and placement, use a stable power supply, and minimize parasitic capacitance and inductance in the circuit. Additionally, the device's output should be properly terminated, and the input should be properly biased.
  • The maximum power dissipation of the TLV9002SIDGSR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 450mW at 25°C ambient temperature. However, it is recommended to derate the power dissipation based on the actual operating conditions.
  • The TLV9002SIDGSR is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's performance and consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • To troubleshoot issues with the TLV9002SIDGSR, start by verifying the power supply voltage, input bias, and output loading. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use an oscilloscope to monitor the input and output signals, and consult the datasheet and application notes for guidance on troubleshooting common issues.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLV9002SIDGSR Overview

Use the download button to access the TLV9002SIDGSR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLV90, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TLV9002SIDGSR

Showing 0 results