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TLV9002SIYCKR - Texas Instruments

Description: Operational Amplifiers - Op Amps 2-channel, 1-MHz, RRIO, 1.8-V to 5.5-V operational amplifier 9-DSBGA -40 to 125

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TLV9002SIYCKR - Texas Instruments PCB footprint - BGA - BGA - TLV9002SIYCKR
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TLV9002SIYCKR - Texas Instruments  - 3D model - BGA - TLV9002SIYCKR
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TLV9002SIYCKR Details

  • Manufacturer Part Number:

    TLV9002SIYCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    S-XBGA-B9

  • JESD-609 Code:

    e1

  • Length:

    0.95 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.33 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    158489

  • Wideband:

    NO

  • Width:

    0.95 mm

TLV9002SIYCKR Frequently Asked Questions (FAQs)

  • It is recommended to place the TLV9002SIYCKR close to the power source, use a solid ground plane, and keep the input and output traces short and separate to minimize noise. Additionally, decoupling capacitors should be placed close to the device.
  • To ensure stability, the TLV9002SIYCKR requires a minimum capacitance of 10nF between the output and ground. Additionally, the device should be operated within the recommended operating conditions, and the input and output impedance should be matched to prevent oscillations.
  • The maximum power dissipation of the TLV9002SIYCKR is dependent on the ambient temperature and the thermal resistance of the package. The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout. The maximum power dissipation can be found in the datasheet.
  • The TLV9002SIYCKR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's power dissipation and operating frequency at high temperatures.
  • The TLV9002SIYCKR has built-in overcurrent protection, but it is still recommended to add external protection circuitry, such as a voltage regulator and a current limiter, to prevent damage from overvoltage and overcurrent conditions.

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TLV9002SIYCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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