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TLV9162IDGKR - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual, 16-V, 10-MHz, rail-to-rail input/output (RRIO) operational amplifier

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TLV9162IDGKR - Texas Instruments - PCB symbol
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PCB Footprints
TLV9162IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK0008A_2026-1
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3D Models
TLV9162IDGKR - Texas Instruments - 3D model - Small Outline Packages - DGK0008A_2026-1
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TLV9162IDGKR Details

  • Manufacturer Part Number:

    TLV9162IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    33 V/us

  • Supply Current-Max:

    5.68 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    11000

  • Voltage Gain-Min:

    158489.3192

  • Wideband:

    NO

  • Width:

    3 mm

TLV9162IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLV9162 datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, the TI website has a PCB layout guide that provides more detailed information on how to design a PCB for the TLV9162IDGKR.
  • The selection of input and output capacitors depends on the specific application and operating conditions. Texas Instruments recommends using low-ESR capacitors with a minimum capacitance of 1uF for the input and output. The datasheet provides more detailed information on capacitor selection and the TI website has a capacitor selection guide that can be used to determine the optimal capacitor values.
  • The TLV9162IDGKR has an operating temperature range of -40°C to 125°C. However, the device can be operated at temperatures above 125°C for short periods of time, but this may affect its reliability and lifespan.
  • To ensure stability, the TLV9162IDGKR requires a minimum output capacitance of 1uF and a minimum ESR of 0.1 ohms. Additionally, the device should be operated within its recommended operating conditions, and the input and output voltages should be within the specified ranges. The datasheet provides more detailed information on stability and oscillation prevention.
  • The maximum input voltage that can be applied to the TLV9162IDGKR is 18V. Exceeding this voltage may damage the device or affect its performance.

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TLV9162IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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