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TLV9351IDCKR - Texas Instruments

Description: Operational Amplifiers - Op Amps 40-V, single 3.5-MHz, RRO, MUX-friendly operational amplifier for cost-sensitive systems 5-SC70 -40 to 125

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PCB Footprints
TLV9351IDCKR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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3D Models
TLV9351IDCKR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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TLV9351IDCKR Details

  • Manufacturer Part Number:

    TLV9351IDCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-09-03

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage Limit-Max:

    42 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    630957.34

  • Wideband:

    YES

TLV9351IDCKR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV9351IDCKR involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The output capacitor should be chosen based on the desired output voltage ripple, output current, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10uF to 22uF, and a voltage rating of at least 2x the output voltage. X5R or X7R ceramic capacitors are recommended for their low ESR and high reliability.
  • The TLV9351IDCKR can handle input voltages up to 18V, but it's recommended to keep the input voltage below 15V to ensure optimal performance and reliability.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a suitable output capacitor, and add a compensation capacitor (typically 10pF to 100pF) between the COMP pin and GND. Additionally, the input voltage should be well-regulated, and the device should be operated within its recommended operating conditions.
  • The TLV9351IDCKR can deliver up to 3A of output current, but it's recommended to keep the output current below 2.5A to ensure optimal performance and reliability.

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TLV9351IDCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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