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TLV9352IDDFR - Texas Instruments

Description: Operational Amplifiers - Op Amps 40-V, dual 3.5MHz, RRO, MUX-friendly operational amplifier for cost-sensitive systems 8-SOT-23-THIN -40 to 125

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PCB Footprints
TLV9352IDDFR - Texas Instruments PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - DDF0008A
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3D Models
TLV9352IDDFR - Texas Instruments  - 3D model - SOT23 (8-Pin) - DDF0008A
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TLV9352IDDFR Details

  • Manufacturer Part Number:

    TLV9352IDDFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-07-18

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    42 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV9352IDDFR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV9352IDDFR involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a low-ESR output capacitor, and add a compensation capacitor (if necessary). Additionally, ensure that the input and output voltages are within the recommended operating range, and the device is not operated in a high-impedance state.
  • The maximum safe operating area (SOA) for the TLV9352IDDFR is limited by the device's thermal and electrical constraints. The device can operate safely within the recommended operating conditions, but exceeding these conditions can lead to reduced reliability or even device failure.
  • Proper thermal management is crucial for the TLV9352IDDFR. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. The device's thermal resistance (θJA) is approximately 24°C/W, and the maximum junction temperature is 150°C.
  • To minimize EMI and RFI, use a shielded enclosure, keep the device away from antennas and other EMI sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, ensure that the PCB layout is designed to minimize radiation and coupling.

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TLV9352IDDFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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