SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Seated Height-Max:
1.45 mm
Slew Rate-Nom:
25 V/us
Supply Current-Max:
3 mA
Supply Voltage Limit-Max:
42 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.95 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
10600
Voltage Gain-Min:
100000
Wideband:
NO
Width:
1.6 mm
TLV9361IDBVR Frequently Asked Questions (FAQs)
A good PCB layout for the TLV9361IDBVR involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
The output capacitor should be chosen based on the desired output voltage ripple, output current, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10uF to 22uF, and a voltage rating of at least 2x the output voltage. X5R or X7R ceramic capacitors are recommended for their low ESR and high reliability.
The TLV9361IDBVR can handle input voltages up to 18V, but it's recommended to keep the input voltage below 15V to ensure optimal performance and reliability. Exceeding the maximum input voltage can lead to reduced performance, increased power consumption, and potentially damage the device.
To ensure stability, it's essential to follow the recommended PCB layout, use a suitable output capacitor, and ensure that the input voltage is within the recommended range. Additionally, it's recommended to add a small ceramic capacitor (e.g., 10nF) between the VIN and GND pins to filter out high-frequency noise.
The TLV9361IDBVR can deliver up to 3A of output current, but it's recommended to keep the output current below 2.5A to ensure optimal performance and reliability. Exceeding the maximum output current can lead to reduced performance, increased power consumption, and potentially damage the device.
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TLV9361IDBVR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
