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TLV9362IDGKR - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual, 40-V, 10.6-MHz rail-to-rail output operational amplifier 8-VSSOP -40 to 125

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TLV9362IDGKR - Texas Instruments - PCB symbol
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TLV9362IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - TLV9362IDGKR*
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TLV9362IDGKR - Texas Instruments - 3D model - Small Outline Packages - TLV9362IDGKR*
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TLV9362IDGKR Details

  • Manufacturer Part Number:

    TLV9362IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1700 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    25 V/us

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    42 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    10600

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3 mm

TLV9362IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLV9362IDGKR datasheet, which includes guidelines for component placement, routing, and thermal management. Additionally, TI recommends using a 4-layer PCB with a solid ground plane to minimize noise and improve thermal dissipation.
  • The output capacitor selection depends on the desired output voltage ripple, transient response, and stability. TI recommends using a low-ESR ceramic capacitor with a value between 10uF to 22uF. A higher capacitance value can reduce output voltage ripple but may affect transient response.
  • Although the datasheet specifies a maximum input voltage of 42V, the TLV9362IDGKR can handle input voltage transients up to 50V for a short duration (less than 100ms). However, it's essential to ensure that the input voltage remains within the specified range for reliable operation.
  • The TLV9362IDGKR has a built-in OVP feature that can be enabled by connecting the OVP pin to a voltage divider network. The OVP threshold can be set by selecting the appropriate resistor values. TI provides a detailed OVP implementation guide in the datasheet and application notes.
  • The thermal derating curve for the TLV9362IDGKR is not explicitly provided in the datasheet. However, TI recommends following the thermal design guidelines and using thermal simulation tools to estimate the junction temperature. The device's power dissipation should be derated according to the ambient temperature to ensure reliable operation.

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TLV9362IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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