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TMAG5231B1DQDBZR - Texas Instruments

Description: Low Power Hall Effect Switch

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TMAG5231B1DQDBZR - Texas Instruments - PCB symbol
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PCB Footprints
TMAG5231B1DQDBZR - Texas Instruments PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - DBZ0003A HEIGHT 1.12_
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3D Models
TMAG5231B1DQDBZR - Texas Instruments - 3D model - SOT23 (3-Pin) - DBZ0003A HEIGHT 1.12_
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TMAG5231B1DQDBZR Details

  • Manufacturer Part Number:

    TMAG5231B1DQDBZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Body Breadth:

    1.3 mm

  • Body Height:

    0.95 mm

  • Body Length or Diameter:

    2.92 mm

  • Housing:

    PLASTIC

  • Hysteresis:

    1.35 mT

  • Input Mode:

    OMNIPOLAR

  • JESD-609 Code:

    e3

  • Magnetic Field Range-Max:

    3.8 mT

  • Magnetic Field Range-Min:

    0.5 mT

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    3

  • Operating Current-Max:

    0.000003 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    PUSH-PULL

  • Output Current-Max:

    5 mA

  • Output Range:

    -5-5mA

  • Output Type:

    DIGITAL CURRENT

  • Package Equivalence Code:

    TO-236

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    MAGNETIC FIELD SENSOR,HALL EFFECT

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.65 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Termination Type:

    SOLDER

TMAG5231B1DQDBZR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and the decoupling capacitors should be placed as close to the device as possible.
  • Use a high-quality, low-ESR decoupling capacitor (e.g., 10uF, 100nF, and 10nF) as close to the device as possible. Ensure the power supply is stable and has a low ripple voltage. Use a separate power plane for the device and ensure it is not shared with other components.
  • Use a thermal pad or thermal tape to attach the device to a heat sink or a metal plate. Ensure good airflow around the device and avoid blocking airflow with other components. Consider using a thermal interface material (TIM) to improve heat transfer.
  • Use an oscilloscope to monitor the device's output and input signals. Check the power supply voltage and ensure it is within the recommended range. Verify the device is properly decoupled and the PCB layout is correct. Consult the datasheet and application notes for troubleshooting guides.
  • Use a shielded enclosure and ensure the device is properly grounded. Use EMI filters or common-mode chokes on the input and output lines. Ensure the PCB layout is optimized for EMI reduction, and use a ground plane to reduce radiation.

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TMAG5231B1DQDBZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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