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TMDS341PFC - Texas Instruments

Description: 3-to1 DVI/HDMI Switch

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TMDS341PFC - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PFC0080A
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TMDS341PFC - Texas Instruments  - 3D model - Quad Flat Packages - PFC0080A
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TMDS341PFC Details

  • Manufacturer Part Number:

    TMDS341PFC

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    80

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    3-CHANNEL MUX/DEMUX

  • Analog IC - Other Type:

    AUDIO/VIDEO SWITCH

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e4

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • On-state Resistance-Max (Ron):

    50 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP80,.55SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    230 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    800 ns

  • Switch-on Time-Max:

    800 ns

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

TMDS341PFC Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA945, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The transformer selection depends on the input voltage, output voltage, and power rating of the design. Texas Instruments provides a transformer selection guide in the application note SLUA946, which includes a step-by-step process for selecting the right transformer and calculating the transformer's turns ratio, inductance, and magnetizing current.
  • The maximum allowed voltage stress on the TMDS341PFC's MOSFETs during startup and shutdown is dependent on the specific application and the voltage rating of the MOSFETs. As a general guideline, the voltage stress should be limited to 1.5 times the maximum input voltage to ensure reliable operation and prevent damage to the MOSFETs.
  • The TMDS341PFC has built-in OVP and UVP circuits, but external components are required to implement these features. Texas Instruments provides a detailed implementation guide in the application note SLUA947, which includes circuit diagrams and component selection guidelines for OVP and UVP.
  • The TMDS341PFC has a high power density, and thermal management is critical to ensure reliable operation. Texas Instruments recommends using a heat sink with a thermal resistance of less than 10°C/W, and ensuring good airflow around the device. Additionally, the application note SLUA948 provides guidelines for thermal interface material selection and heat sink design.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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