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TMS320C6722BRFP250 - Texas Instruments

Description: Texas Instruments TMS320C6722BRFP250, 32 bit, 64 bit Digital Signal Processor 350MHz 32 kB EPROM 144-Pin HTQFP

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TMS320C6722BRFP250 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - RFP(S-PQFP-G144)
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3D Models
TMS320C6722BRFP250 - Texas Instruments  - 3D model - Quad Flat Packages - RFP(S-PQFP-G144)
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TMS320C6722BRFP250 Details

  • Manufacturer Part Number:

    TMS320C6722BRFP250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    144

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

  • Address Bus Width:

    32

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    4

  • Number of DMA Channels:

    16

  • Number of Terminals:

    144

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP144,.9SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    131072

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6722BRFP250 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (1.2V) first, followed by VIO (1.8V or 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.
  • To configure the EMIF for optimal performance, ensure that the memory clock frequency is set to 1/2 or 1/4 of the CPU clock frequency. Also, adjust the EMIF timing parameters (e.g., CAS latency, RAS-to-CAS delay) based on the specific memory module used.
  • The maximum allowed clock skew between the CPU clock and the EMIF clock is 1.5 ns. Exceeding this limit may cause data corruption or system instability.
  • A reliable reset mechanism can be implemented using a power-on reset (POR) circuit, which generates a reset signal when the power supply voltage reaches a minimum threshold (e.g., 0.9V). Additionally, use a reset supervisor IC to monitor the power supply voltage and generate a reset signal if it falls below a certain threshold.
  • To ensure reliable operation, maintain a maximum junction temperature (TJ) of 125°C. Use thermal design guidelines to minimize thermal resistance, such as using a heat sink, thermal interface material, and optimizing the PCB layout for heat dissipation.

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TMS320C6722BRFP250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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