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TMS320C6727BGDH300 - Texas Instruments

Description: Floating-Point Digital Signal Processor

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PCB Footprints
TMS320C6727BGDH300 - Texas Instruments PCB footprint - BGA - BGA - GDH(S-PBGA-N256)
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3D Models
TMS320C6727BGDH300 - Texas Instruments  - 3D model - BGA - GDH(S-PBGA-N256)
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TMS320C6727BGDH300 Details

  • Manufacturer Part Number:

    TMS320C6727BGDH300

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

  • Address Bus Width:

    32

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of Terminals:

    256

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    262144

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    2.02 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6727BGDH300 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (1.2V) first, followed by VIO (1.8V or 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.
  • To configure the EMIF for optimal performance, ensure that the memory timing parameters (e.g., CAS latency, RAS-to-CAS delay) are set according to the memory device's datasheet. Additionally, adjust the EMIF clock frequency and phase to match the memory device's requirements.
  • The maximum clock frequency supported by the TMS320C6727BGDH300 is 350 MHz. However, the actual clock frequency may be limited by the specific application, PCB design, and environmental conditions.
  • To implement a reliable boot process, use a boot loader that can recover from errors and ensure data integrity. Implement a checksum or CRC check on the boot loader and application code to detect any corruption. Additionally, use a secure boot mechanism, such as encryption and authentication, to prevent unauthorized access.
  • To ensure proper thermal management, ensure good airflow around the device, use a heat sink or thermal interface material, and avoid blocking the thermal pads on the package. Monitor the device's temperature using the on-chip temperature sensor and take corrective action if the temperature exceeds the recommended operating range.

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TMS320C6727BGDH300 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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