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TMS320DM368ZCEF - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Dig Media SOC

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TMS320DM368ZCEF - Texas Instruments - PCB symbol
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PCB Footprints
TMS320DM368ZCEF - Texas Instruments PCB footprint - BGA - BGA - ZCE (S-PBGA-N338)_2021
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3D Models
TMS320DM368ZCEF - Texas Instruments - 3D model - BGA - ZCE (S-PBGA-N338)_2021
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TMS320DM368ZCEF Details

  • Manufacturer Part Number:

    TMS320DM368ZCEF

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    338

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bit Size:

    32

  • Bus Compatibility:

    I2C; SPI; UART; USB

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • JESD-30 Code:

    S-PBGA-B338

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    338

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA338,19X19,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    8192

  • Seated Height-Max:

    1.3 mm

  • Supply Voltage-Max:

    1.42 V

  • Supply Voltage-Min:

    1.28 V

  • Supply Voltage-Nom:

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    Digital Media SoC

TMS320DM368ZCEF Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply power to the DVDD and CVDD pins first, followed by the AVDD and DVDDIO pins. This ensures that the internal voltage regulators are powered up correctly.
  • The clock settings can be configured using the PLL (Phase-Locked Loop) and clock divider registers. The PLL can be configured to generate a clock frequency of up to 720 MHz, and the clock divider can be used to divide the clock frequency to generate the desired clock speed for the CPU and peripherals.
  • The maximum operating temperature range for the DM368 is -40°C to 85°C. However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.
  • A boot loader can be implemented using the ROM boot loader or by creating a custom boot loader using the DM368's flash memory. The ROM boot loader can be configured to boot from various sources such as NAND flash, SD/MMC, or UART. A custom boot loader can be developed using the DM368's SDK and programming tools.
  • The DM368 can support up to 2 GB of external memory, including NAND flash, NOR flash, and SDRAM. The memory interface is 16-bit wide, and the device supports various memory interfaces such as NAND, NOR, and DDR2.

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TMS320DM368ZCEF Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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