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TMS320VC549GGU-80 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Dig Sig Proc

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PCB Footprints
TMS320VC549GGU-80 - Texas Instruments PCB footprint - BGA - BGA - GGU (S-PBGA-N144)
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3D Models
TMS320VC549GGU-80 - Texas Instruments  - 3D model - BGA - GGU (S-PBGA-N144)
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TMS320VC549GGU-80 Details

  • Manufacturer Part Number:

    TMS320VC549GGU-80

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-144

  • Pin Count:

    144

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    23

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    20 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e0

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA144,13X13,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    65536

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max:

    2.75 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320VC549GGU-80 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (1.8V) first, followed by VDDA (1.8V), and then VDDS (3.3V). This ensures proper device operation and prevents latch-up.
  • To optimize the clock tree, use the clock domain crossing (CDC) feature to minimize clock skew and ensure proper synchronization between clock domains. Additionally, use the clock gating feature to reduce power consumption.
  • The maximum operating temperature range for the TMS320VC549GGU-80 is -40°C to 85°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 70°C for optimal performance and reliability.
  • To implement a DDR memory interface, use the DDR2/DDR3 memory interface module (EMIF) integrated into the TMS320VC549GGU-80. Configure the EMIF module according to the DDR memory type and speed, and ensure proper signal integrity and termination.
  • The maximum bandwidth of the EMAC in the TMS320VC549GGU-80 is 1 Gbps. However, the actual bandwidth may vary depending on the system configuration, network traffic, and other factors.

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TMS320VC549GGU-80 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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