TMS32C6203BGNZA250 - Texas Instruments

TMS32C6203BGNZA250 Details

• Manufacturer Part Number:

  TMS32C6203BGNZA250

• Brand Name:

  Texas Instruments

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  27 X 27 MM, PLASTIC, BGA-352

• Pin Count:

  352

• Country Of Origin:

  Philippines

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.35

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Additional Feature:

  ALSO REQUIRES 3.3V SUPPLY

• Address Bus Width:

  22

• Barrel Shifter:

  NO

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  250 MHz

• External Data Bus Width:

  32

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• Internal Bus Architecture:

  MULTIPLE

• JESD-30 Code:

  S-PBGA-B352

• JESD-609 Code:

  e0

• Length:

  27 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  4

• Number of DMA Channels:

  4

• Number of External Interrupts:

  4

• Number of Terminals:

  352

• Number of Timers:

  2

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA352,26X26,50

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  220

• Qualification Status:

  Not Qualified

• RAM (words):

  524288

• ROM Programmability:

  MROM

• Seated Height-Max:

  2.8 mm

• Supply Voltage-Max:

  1.57 V

• Supply Voltage-Min:

  1.43 V

• Supply Voltage-Nom:

  1.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  DIGITAL SIGNAL PROCESSOR, OTHER