Part Image

TMS5701115BPGEQQ1 - Texas Instruments

Description: ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU

Download TMS5701115BPGEQQ1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TMS5701115BPGEQQ1 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PGE (S-PQFP-G144)
click to zoom
3D Models
TMS5701115BPGEQQ1 - Texas Instruments  - 3D model - Quad Flat Packages - PGE (S-PQFP-G144)
click to zoom

TMS5701115BPGEQQ1 Details

  • Manufacturer Part Number:

    TMS5701115BPGEQQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-144

  • Pin Count:

    144

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-R4F

  • Clock Frequency-Max:

    80 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    58

  • Number of Terminals:

    144

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    131072

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Speed:

    160 MHz

  • Supply Current-Max:

    350 mA

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

TMS5701115BPGEQQ1 Frequently Asked Questions (FAQs)

  • The recommended oscillator crystal frequency for the TMS5701115BPGEQQ1 is 16 MHz or 20 MHz, depending on the specific application and clock speed requirements.
  • To configure the flash memory for optimal performance and endurance, it is recommended to use the Flash API provided by Texas Instruments, which includes functions for programming, erasing, and verifying the flash memory. Additionally, it is important to follow the guidelines for flash memory usage and wear leveling to ensure optimal performance and endurance.
  • The power consumption characteristics of the TMS5701115BPGEQQ1 vary depending on the operating frequency, voltage, and mode of operation. According to the datasheet, the typical power consumption is around 250 μA/MHz at 1.2 V and 25°C. However, it is recommended to consult the datasheet and perform power consumption measurements to determine the actual power consumption for a specific application.
  • The TMS5701115BPGEQQ1 has built-in features to support functional safety and security, such as error correction code (ECC) for flash and RAM, watchdog timers, and a hardware security module (HSM). To implement functional safety and security features, it is recommended to consult the datasheet and application notes, and to follow the guidelines for safety and security provided by Texas Instruments and industry standards such as IEC 61508 and ISO 26262.
  • The TMS5701115BPGEQQ1 has a maximum junction temperature of 150°C. To ensure reliable operation, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. It is also important to consult the datasheet and thermal design guidelines provided by Texas Instruments.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TMS5701115BPGEQQ1 Overview

Use the download button to access the TMS5701115BPGEQQ1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TMS57, or try a keyword search, such as Microcontrollers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TMS5701115BPGEQQ1

Showing 0 results