Part Image

TMS5703135DPGEQQ1 - Texas Instruments

Description: ARM® Cortex®-R4F Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R Microcontroller IC 16/32-Bit 160MHz 3MB (3M x 8) FLASH 144-LQFP (20x20)

Download TMS5703135DPGEQQ1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TMS5703135DPGEQQ1 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PGE (S-PQFP-G144)
click to zoom
3D Models
TMS5703135DPGEQQ1 - Texas Instruments  - 3D model - Quad Flat Packages - PGE (S-PQFP-G144)
click to zoom

TMS5703135DPGEQQ1 Details

  • Manufacturer Part Number:

    TMS5703135DPGEQQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-R4F

  • Clock Frequency-Max:

    80 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    4

  • Number of I/O Lines:

    144

  • Number of Serial I/Os:

    7

  • Number of Terminals:

    144

  • Number of Timers:

    51

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    262144

  • ROM (words):

    3145728

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Speed:

    160 MHz

  • Supply Current-Max:

    700 mA

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

TMS5703135DPGEQQ1 Frequently Asked Questions (FAQs)

  • The recommended oscillator crystal frequency for the TMS5703135DPGEQQ1 is 16 MHz or 20 MHz, depending on the specific application and clock speed requirements.
  • To configure the flash memory for optimal performance and endurance, it is recommended to use the Flash API provided by Texas Instruments, which includes functions for programming, erasing, and verifying the flash memory. Additionally, it is important to follow the guidelines for flash memory usage and wear leveling to ensure optimal performance and endurance.
  • The built-in self-test (BIST) feature of the TMS5703135DPGEQQ1 has limitations in terms of coverage and detection of faults. It is recommended to use the BIST feature in conjunction with other testing methods, such as boundary scan and functional testing, to ensure comprehensive testing of the device. Additionally, it is important to follow the guidelines provided by Texas Instruments for using the BIST feature effectively.
  • To implement secure boot mechanisms, it is recommended to use the security features provided by the TMS5703135DPGEQQ1, such as the Secure Hash Algorithm (SHA) and the Advanced Encryption Standard (AES). Additionally, it is important to follow the guidelines provided by Texas Instruments for implementing secure boot mechanisms, including using secure boot keys, encrypting boot code, and verifying the authenticity of the boot code.
  • The TMS5703135DPGEQQ1 has a maximum operating temperature of 125°C, and it is recommended to follow the thermal management guidelines provided by Texas Instruments to ensure reliable operation in high-temperature environments. This includes using thermal interfaces, such as heat sinks and thermal pads, and ensuring good airflow around the device. Additionally, it is important to monitor the device temperature and adjust the operating frequency and voltage accordingly to prevent overheating.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TMS5703135DPGEQQ1 Overview

Use the download button to access the TMS5703135DPGEQQ1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TMS57, or try a keyword search, such as Microcontrollers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to TMS5703135DPGEQQ1

Showing 0 results