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TMSDC6726BRFPA225 - Texas Instruments

Description: Texas Instruments TMSDC6726BRFPA225, 32 bit, 64 bit Digital Signal Processor 225MHz 32 kB Flash 144-Pin HTQFP

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PCB Footprints
TMSDC6726BRFPA225 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - RFP(S-PQFP-G144)
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3D Models
TMSDC6726BRFPA225 - Texas Instruments  - 3D model - Quad Flat Packages - RFP(S-PQFP-G144)
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TMSDC6726BRFPA225 Details

  • Manufacturer Part Number:

    TMSDC6726BRFPA225

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    144

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

  • Address Bus Width:

    32

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    4

  • Number of DMA Channels:

    16

  • Number of Terminals:

    144

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP144,.9SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    262144

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMSDC6726BRFPA225 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • To ensure signal integrity, use controlled impedance traces, and follow the recommended routing guidelines for the high-speed interfaces such as PCIe and SATA. Additionally, use signal termination and shielding to minimize electromagnetic interference (EMI).
  • The recommended power-up sequence is to power up the core voltage (VDD) first, followed by the input/output voltage (VDDIO). This ensures that the internal voltage regulators are powered up correctly and prevents any potential damage to the device.
  • To optimize power consumption, use the device's power management features such as dynamic voltage and frequency scaling, and clock gating. Additionally, use the lowest possible voltage and frequency required for the application, and consider using power-saving modes such as idle or sleep modes.
  • The recommended method for firmware updates is to use a secure boot mechanism, such as a secure boot loader, to ensure the authenticity and integrity of the firmware. Additionally, use a secure communication protocol, such as HTTPS, to transfer the firmware update to the device.

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TMSDC6726BRFPA225 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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