SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.2 mm
Signal Current-Max:
0.025 A
Supply Current-Max (Isup):
0.001 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
1.62 V
Supply Voltage-Nom (Vsup):
1.8 V
Surface Mount:
YES
Switch-off Time-Max:
105 ns
Switch-on Time-Max:
75 ns
Switching:
BREAK-BEFORE-MAKE
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
TMUX1309PWR Frequently Asked Questions (FAQs)
Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital signals separate. Additionally, it's recommended to use a common mode filter and to decouple the power supply pins with capacitors.
The configuration of TMUX1309PWR depends on the specific application requirements. For a battery-powered device, it's recommended to use the low-power mode and to optimize the mux configuration for low power consumption. For a high-speed data acquisition system, it's recommended to use the high-speed mode and to optimize the mux configuration for low latency and high throughput.
The maximum operating frequency of the TMUX1309PWR is 100 MHz. At high frequencies, the signal integrity may be affected by the parasitic capacitance and inductance of the mux. It's recommended to use a termination resistor and to optimize the PCB layout to minimize the signal reflections and distortion.
To ensure the reliability and fault tolerance of the TMUX1309PWR, it's recommended to use redundant circuits, error detection and correction mechanisms, and to implement a fault detection and isolation strategy. Additionally, it's recommended to follow the guidelines for safety-critical systems and to perform thorough testing and validation.
The TMUX1309PWR has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. This can be achieved by using a heat sink, thermal interface material, and optimizing the PCB layout for good thermal dissipation.
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TMUX1309PWR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
