It can act as 10 Single Channel SPDT or 5 Differential Channel SPDT
Analog IC - Other Type:
SPDT
Bandwidth-Nom:
6000 MHz
Input Voltage-Max:
3.6 V
JESD-30 Code:
S-PBGA-B36
JESD-609 Code:
e1
Length:
2.45 mm
Moisture Sensitivity Level:
2
Normal Position:
NO
Number of Channels:
10
Number of Functions:
1
Number of Terminals:
36
Off-state Isolation-Nom:
20 dB
On-state Resistance Match-Nom:
0.1 Ω
On-state Resistance-Max (Ron):
10 Ω
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output:
SEPARATE OUTPUT
Package Body Material:
PLASTIC/EPOXY
Package Code:
VFBGA
Package Equivalence Code:
BGA36,6X6,16
Package Shape:
SQUARE
Package Style:
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
0.65 mm
Signal Current-Max:
0.035 A
Supply Current-Max (Isup):
0.055 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
1.5 V
Supply Voltage-Nom (Vsup):
3.6 V
Surface Mount:
YES
Switch-off Time-Max:
1500 ns
Switch-on Time-Max:
1500 ns
Switching:
BREAK-BEFORE-MAKE
Technology:
CMOS
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
0.4 mm
Terminal Position:
BOTTOM
Width:
2.45 mm
TMUX646NZECR Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the analog and digital grounds are separated and connected at a single point.
The TMUX646NZECR has a thermal pad that must be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Keep the device away from heat sources, and avoid blocking airflow around the device.
The recommended power-up sequence is to apply VCC first, followed by VCCA, and then the input signals. This sequence helps prevent latch-up and ensures proper device operation. It's also essential to ensure that the power supplies are stable and within the recommended voltage ranges.
Start by verifying the power-up sequence, voltage levels, and signal integrity. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use oscilloscopes or logic analyzers to debug signal issues, and consult the datasheet and application notes for guidance.
In high-reliability or automotive applications, it's essential to follow the recommended operating conditions, ensure proper thermal management, and use a robust PCB design. Additionally, consider using a device with a higher temperature rating, such as the TMUX646NZECRQ1, which is qualified for automotive applications.
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TMUX646NZECR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
