TMX5703137AZWTQQ1 - Texas Instruments

TMX5703137AZWTQQ1 Details

• Manufacturer Part Number:

  TMX5703137AZWTQQ1

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  GREEN, PLASTIC, NFBGA-337

• Pin Count:

  337

• ECCN Code:

  3A991.a.2

• HTS Code:

  8542.31.00.25

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Has ADC:

  YES

• Additional Feature:

  ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY

• Address Bus Width:

  16

• Bit Size:

  32

• CPU Family:

  CORTEX-R4F

• Clock Frequency-Max:

  80 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• External Data Bus Width:

  16

• JESD-30 Code:

  S-PBGA-B337

• JESD-609 Code:

  e1

• Length:

  16 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  44

• Number of Terminals:

  337

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA337,19X19,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  262144

• ROM (words):

  3145728

• ROM Programmability:

  FLASH

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.4 mm

• Speed:

  180 MHz

• Supply Current-Max:

  405 mA

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  16 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC