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TN0104N3-G - Microchip

Description: N-Channel 40 V 450mA (Ta) 1W (Tc) Through Hole TO-92-3

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TN0104N3-G - Microchip PCB footprint - Other - Other - TO-92-3_2025-1.1
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TN0104N3-G - Microchip  - 3D model - Other - TO-92-3_2025-1.1
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TN0104N3-G Details

  • Manufacturer Part Number:

    TN0104N3-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LOW THRESHOLD

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    0.45 A

  • Drain-source On Resistance-Max:

    1.8 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1 W

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TN0104N3-G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal pad is connected to a large copper area on the PCB to improve heat dissipation.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, including using a thermally efficient layout, minimizing thermal resistance, and ensuring adequate power supply decoupling. Additionally, consider using a temperature sensor to monitor the device temperature and implement thermal protection mechanisms if necessary.
  • For EMI and EMC compliance, it is crucial to follow proper PCB design and layout guidelines, including using a solid ground plane, minimizing signal loop areas, and using shielding and filtering techniques as necessary. Additionally, ensure that the device is properly decoupled, and consider using EMI filters or common-mode chokes to reduce emissions.
  • To troubleshoot issues related to power sequencing and voltage regulation, start by verifying the power-up sequence and ensuring that the voltage rails are properly sequenced. Check the voltage regulator output for stability and accuracy, and verify that the input voltage is within the recommended range. Use an oscilloscope to monitor the voltage rails and identify any anomalies or oscillations.
  • To prevent damage, store the TN0104N3-G in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or electrical connections. Use anti-static wrist straps or mats when handling the device, and avoid bending or flexing the pins during insertion or removal.

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TN0104N3-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image TN0104N3-GP014 Microchip Technology Inc

Small Signal Field-Effect Transistor, 0.45A I(D), 40V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-92