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TN0106N3-G-P003 - Microchip

Description: MOSFETs N-Channel DMOS FET Low Threshold 2.0V

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TN0106N3-G-P003 - Microchip PCB footprint - Other - Other - 3-lead TO-92_2024-1
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TN0106N3-G-P003 - Microchip  - 3D model - Other - 3-lead TO-92_2024-1
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TN0106N3-G-P003 Details

  • Manufacturer Part Number:

    TN0106N3-G-P003

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.35 A

  • Drain-source On Resistance-Max:

    3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    8 pF

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1 W

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TN0106N3-G-P003 Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink or PCB. Operating the device within the recommended temperature range and providing adequate cooling will also help ensure reliable operation.
  • Operating the TN0106N3-G-P003 beyond the recommended voltage range can lead to reduced reliability, increased power consumption, and potentially even device failure. It's essential to operate the device within the recommended voltage range to ensure optimal performance and reliability.
  • To troubleshoot issues related to power sequencing and voltage ramp-up, verify that the power supply is stable and within the recommended voltage range. Check the voltage ramp-up time and ensure it meets the recommended specifications. Also, review the PCB layout and ensure that the power supply lines are properly decoupled and filtered.
  • To mitigate EMI and RFI in the TN0106N3-G-P003 design, follow proper PCB layout guidelines, such as separating analog and digital signals, using shielding, and implementing filtering and decoupling techniques. Additionally, consider using EMI-absorbing materials and following good design practices for electromagnetic compatibility (EMC).

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TN0106N3-G-P003 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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