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TN2106K1-G - Microchip

Description: SOT-23-3

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TN2106K1-G - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23
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TN2106K1-G - Microchip  - 3D model - SOT23 (3-Pin) - SOT-23
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TN2106K1-G Details

  • Manufacturer Part Number:

    TN2106K1-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LOW THRESHOLD, LOGIC LEVEL COMPATIBLE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.28 A

  • Drain-source On Resistance-Max:

    2.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    8 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.36 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TN2106K1-G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the PCB layout allows for good airflow around the device.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, consider using a thermal sensor to monitor the device temperature and implement thermal shutdown or throttling if necessary.
  • The recommended input capacitor is a 10uF ceramic capacitor with X7R or X5R dielectric, and the recommended output capacitor is a 22uF ceramic capacitor with X7R or X5R dielectric. These capacitors help to filter out noise and ensure stable operation.
  • To troubleshoot issues with the device not turning on or not regulating properly, first check the input voltage and ensure it is within the recommended range. Verify that the input and output capacitors are properly connected and of the recommended type. Also, check for any signs of overheating or thermal shutdown. If the issue persists, consult the datasheet and application notes for further guidance.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It is essential to operate the device within the recommended voltage, current, and temperature ranges to ensure reliable and safe operation.

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TN2106K1-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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