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TN5335K1-G - Microchip

Description: MOSFET 350V 15Ohm

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TN5335K1-G - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
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3D Models
TN5335K1-G - Microchip  - 3D model - SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for TN5335K1-G
  • Part Number TN5335K1-G
  • Manufacturer Microchip
  • Pin Count 3
  • Part Category MOSFET (N-Channel)
  • Package Category SOT23 (3-Pin)
  • Footprint Name SOT23 (3-Pin) - 3-Lead TO-236AB (SOT-23) Package Outline (K1) 2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
  • Released Date Mar 28, 2018
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

TN5335K1-G Details

  • Manufacturer Part Number:

    TN5335K1-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    350 V

  • Drain Current-Max (ID):

    0.11 A

  • Drain-source On Resistance-Max:

    15 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    22 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    0.36 W

  • Power Dissipation-Max (Abs):

    0.36 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TN5335K1-G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal vias are connected to the ground plane and that the component is placed near a thermal pad or heat sink.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, consider using a thermal sensor to monitor the device temperature and implement thermal shutdown or throttling mechanisms to prevent overheating.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) before applying the input voltage (VIN). During power-down, the input voltage (VIN) should be removed before removing the power supply voltage (VCC). This ensures that the device is properly biased and prevents any potential latch-up or damage.
  • To troubleshoot issues with the TN5335K1-G, start by verifying the power supply voltage and input voltage levels. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to monitor the device's output and input signals, and verify that the device is properly configured and biased. If the issue persists, consult the datasheet and application notes for guidance or contact Microchip's technical support.
  • Operating the TN5335K1-G beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. This includes exceeding the maximum junction temperature, input voltage, or output current ratings. It is essential to ensure that the device operates within its recommended specifications to guarantee reliable operation and prevent premature failure.

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TN5335K1-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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