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TOP265KG-TL - Power Integrations

Description: AC/DC Converters Int Off-Line Switchr EcoSmart,25W/36W Integrated Off-Line Switcher with EcoSmart Technology for Highly Efficient Power Supplies

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PCB Footprints
TOP265KG-TL - Power Integrations PCB footprint - Other - Other - eSOP-12B (K Package)
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3D Models
TOP265KG-TL - Power Integrations  - 3D model - Other - eSOP-12B (K Package)
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TOP265KG-TL Details

  • Manufacturer Part Number:

    TOP265KG-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    7

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    40

TOP265KG-TL Frequently Asked Questions (FAQs)

  • A good PCB layout for the TOP265KG-TL should have a solid ground plane, keep the input and output stages separate, and use a star-configuration for the transformer connections. Additionally, the feedback components should be placed close to the IC.
  • To ensure reliable start-up and shutdown, the input voltage should be ramped up and down slowly (typically 10-20 ms) to prevent inrush currents and voltage spikes. Also, the soft-start capacitor (CSS) should be sized correctly to limit the inrush current.
  • A pi-filter (C-L-C) or a common-mode choke (CMC) filter is recommended to reduce electromagnetic interference (EMI) and ensure compliance with regulatory standards. The filter components should be selected based on the specific application and input voltage range.
  • To optimize the transformer design, the core material, turns ratio, and wire size should be selected based on the specific application and operating frequency. The transformer should be designed to minimize losses, and the leakage inductance should be kept low to reduce voltage spikes.
  • The TOP265KG-TL has a high power density, so thermal management is critical. The IC should be mounted on a heat sink or a thermally conductive PCB, and the ambient temperature should be kept below 85°C. Additionally, the thermal resistance of the IC package should be minimized by using a thermal interface material.

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TOP265KG-TL Overview

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